Invention Grant
- Patent Title: Laminated electronic component
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Application No.: US16021983Application Date: 2018-06-28
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Publication No.: US11488761B2Publication Date: 2022-11-01
- Inventor: Yuto Shiga , Hajime Kato , Kazuya Tobita , Youichi Kazuta , Yuya Ishima , Satoru Okamoto , Shunji Aoki
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2017-129411 20170630
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/29 ; H01F5/04 ; H01F5/00

Abstract:
A laminated electronic component includes an element body and a conductor. The element body is formed by laminating a plurality of element-body layers. The element body has a first face, a second face, and a pair of third faces. The conductor is disposed on the element body and has an L shape. The conductor has an exposed face exposed on the first face and the second face. The exposed face includes a plurality of divided regions divided by the element body. The length of each divided region in a dividing direction is longer than a distance with which the plurality of divided regions is separated from each other and longer than a distance with which the exposed face and the pair of third faces are separated from each other.
Public/Granted literature
- US20190006084A1 LAMINATED ELECTRONIC COMPONENT Public/Granted day:2019-01-03
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