Invention Grant
- Patent Title: Coil component
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Application No.: US16408746Application Date: 2019-05-10
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Publication No.: US11488768B2Publication Date: 2022-11-01
- Inventor: Sa Yong Lee , Myung Sam Kang
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2015-0163367 20151120
- Main IPC: H01F27/32
- IPC: H01F27/32 ; H01F27/29 ; H01F17/00 ; H01F17/04

Abstract:
A coil component includes: a body including a magnetic material, coil pattern layers disposed in the magnetic material, a core portion surrounded by the coil pattern layers, and an insulating layer disposed in the core portion and between adjacent coil pattern layers among the coil pattern layers, wherein each of the coil pattern layers comprises a spiral-shaped pattern; and an external electrode disposed on the body.
Public/Granted literature
- US20190267182A1 COIL COMPONENT Public/Granted day:2019-08-29
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