- 专利标题: Substrate processing system
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申请号: US16999024申请日: 2020-08-20
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公开(公告)号: US11495480B2公开(公告)日: 2022-11-08
- 发明人: Suguru Motegi , Takashi Kumagai , Akira Kodashima , Keisuke Yoshimura
- 申请人: TOKYO ELECTRON LIMITED
- 申请人地址: JP Tokyo
- 专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人地址: JP Tokyo
- 代理机构: Weihrouch IP
- 优先权: JPJP2019-151748 20190822
- 主分类号: H01L21/67
- IPC分类号: H01L21/67 ; H01J37/32
摘要:
A substrate processing system installed on a floor face is provided. The substrate processing system includes a substrate transfer module, a supporting table including a top plate disposed separately from the floor face, a plurality of substrate processing modules disposed on the top plate and coupled to the substrate transfer module along a lateral side of the substrate transfer module, and a plurality of power units disposed below the top plate. Further, the plurality of power units correspond to the plurality of substrate processing modules, respectively, and each of the power units is configured to supply electric power to the corresponding processing module.
公开/授权文献
- US20210057243A1 SUBSTRATE PROCESSING SYSTEM 公开/授权日:2021-02-25
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