Invention Grant
- Patent Title: Receptacle connector including electromagneiic compatibility (EMC) shield
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Application No.: US16822872Application Date: 2020-03-18
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Publication No.: US11495907B2Publication Date: 2022-11-08
- Inventor: Seon Gyun Baek , Jae Hong Park , Yusuf Cinar , Han Hong Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2019-0080067 20190703,KR10-2019-0127562 20191015
- Main IPC: H01R13/50
- IPC: H01R13/50 ; H01R13/405 ; H01R13/6581 ; H01R13/6585 ; H01R13/6583 ; H01R13/6587 ; H01R24/60 ; H01R13/6582

Abstract:
Provided are a receptacle connector configured to avoid damage to conductors of the receptacle connector. The receptacle connector includes a plurality of connection terminals, a mold structure which comprises a front part exposing each of the connection terminals and a support part disposed on a rear end of the front part and surrounding each of the connection terminals, and a shield which is disposed on the support part and comprises a conductive material, wherein the support part comprises a flat part which includes a surface along which the shield extends and a protruding part which protrudes from the surface of the flat part and is disposed in front of a front end of the shield. The protruding part is configured to avoid damage to conductors of the receptacle when a plug is mated to the receptacle.
Public/Granted literature
- US20210006001A1 RECEPTACLE CONNECTOR Public/Granted day:2021-01-07
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