- 专利标题: High performance, flexible, and compact low-density parity-check (LDPC) code
-
申请号: US17090498申请日: 2020-11-05
-
公开(公告)号: US11496154B2公开(公告)日: 2022-11-08
- 发明人: Thomas Joseph Richardson , Shrinivas Kudekar
- 申请人: QUALCOMM Incorporated
- 申请人地址: US CA San Diego
- 专利权人: QUALCOMM Incorporated
- 当前专利权人: QUALCOMM Incorporated
- 当前专利权人地址: US CA San Diego
- 代理机构: Qualcomm IP Dept.
- 代理商 James Hunt Yancey, Jr.
- 主分类号: H03M13/11
- IPC分类号: H03M13/11 ; H03M13/00 ; H04L1/00 ; G06F11/10 ; G06N10/00 ; H01L39/02 ; H03M13/03 ; H04L1/18
摘要:
Certain aspects of the present disclosure generally relate to techniques for puncturing of structured low-density parity-check (LDPC) codes. Certain aspects of the present disclosure generally relate to methods and apparatus for a high-performance, flexible, and compact LDPC code. Certain aspects can enable LDPC code designs to support large ranges of rates, blocklengths, and granularity, while being capable of fine incremental redundancy hybrid automatic repeat request (IR-HARQ) extension while maintaining good floor performance, a high-level of parallelism to deliver high throughout performance, and a low description complexity.