Invention Grant
- Patent Title: Sealing structure and an electronic device having the same
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Application No.: US16944149Application Date: 2020-07-31
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Publication No.: US11500248B2Publication Date: 2022-11-15
- Inventor: Fiona Jhan , Lavender Cheng
- Applicant: Fiona Jhan , Lavender Cheng
- Applicant Address: TW Pingtung; TW Tainan
- Assignee: Fiona Jhan,Lavender Cheng
- Current Assignee: Fiona Jhan,Lavender Cheng
- Current Assignee Address: TW Pingtung; TW Tainan
- Agency: Patterson + Sheridan, LLP
- Main IPC: H05K1/14
- IPC: H05K1/14 ; G02F1/1339 ; G02F1/1343 ; H05K1/02

Abstract:
A sealing structure is provided. The sealing structure includes two substrates opposite each other, each of which has a sealing region on its periphery. The sealing structure further includes a recess structure having at least one recess in the sealing region of at least one of the two substrates. The sealing structure further includes a sealing material with filler particles, which is disposed along the sealing regions to seal the two substrates, wherein a portion of the filler particles are accommodated in the at least one recess.
Public/Granted literature
- US20220035191A1 A SEALING STRUCTURE AND AN ELECTRONIC DEVICE HAVING THE SAME Public/Granted day:2022-02-03
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