Invention Grant
- Patent Title: Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof
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Application No.: US17418771Application Date: 2020-03-30
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Publication No.: US11500489B2Publication Date: 2022-11-15
- Inventor: Ren Xiong , Qiang Tang , Huiqiang Song
- Applicant: Chengdu BOE Optoelectronics Technology Co., Ltd. , BOE Technology Group Co., Ltd.
- Applicant Address: CN Sichuan; CN Beijing
- Assignee: Chengdu BOE Optoelectronics Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee: Chengdu BOE Optoelectronics Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Sichuan; CN Beijing
- Agency: Arch & Lake LLP
- Priority: CN201910093341.0 20190130,CN201911136276.1 20191119,CN202010075431.X 20200122
- International Application: PCT/CN2020/082216 WO 20200330
- International Announcement: WO2020/156595 WO 20200806
- Main IPC: G06F3/041
- IPC: G06F3/041 ; G06F3/044 ; H05K1/18

Abstract:
This disclosure provides a flexible circuit board and a manufacturing method therefor, and a display device. The flexible circuit board includes a main body sub-circuit board and a bridge sub-circuit board; The main body sub-circuit board includes a first substrate, as well as a first bridge connection end, a second bridge connection end, a first wiring portion, and a second wiring portion disposed on the first substrate The bridge sub-circuit board includes a second substrate, as well as a third bridge connection end, a fourth bridge connection end, and a third wiring portion used for a first functional wiring, all disposed on the second substrate.
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