发明授权
- 专利标题： Multilayer electronic component for enhanced moisture resistance and bending strength
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申请号： US16836125申请日： 2020-03-31
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公开(公告)号： US11501922B2公开(公告)日： 2022-11-15
- 发明人: Dong Yeong Kim , Ji Hong Jo , Woo Chul Shin
- 申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Suwon-si
- 代理机构： Morgan, Lewis & Bockius LLP
- 优先权： KR10-2019-0105819 20190828
- 主分类号： H01G4/30
- IPC分类号： H01G4/30 ; H01G4/008 ; H01G4/012 ; H01G4/12 ; H01G2/02
摘要：
A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region, in which electrode layers are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between an electrode layer and a conductive resin layer of an external electrode, and thus, may improve bending strength and humidity resistance reliability.
公开/授权文献
- US20210065986A1 MULTILAYER ELECTRONIC COMPONENT 公开/授权日：2021-03-04
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