Invention Grant
- Patent Title: Semiconductor chip
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Application No.: US16928909Application Date: 2020-07-14
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Publication No.: US11502046B2Publication Date: 2022-11-15
- Inventor: Shuntaro Machida
- Applicant: Hitachi, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge, P.C.
- Priority: JPJP2019-146036 20190808
- Main IPC: H01L29/82
- IPC: H01L29/82 ; H01L23/00 ; B06B1/02 ; B81B3/00 ; A61B8/00
Abstract:
Provided is a semiconductor chip, including: a semiconductor substrate; a thin film formed on the semiconductor substrate, the thin film having internal stress; and a semiconductor device formed on the semiconductor substrate that has the thin film formed thereon, wherein the semiconductor chip warps due to the internal stress of the thin film.
Public/Granted literature
- US20210043584A1 SEMICONDUCTOR CHIP Public/Granted day:2021-02-11
Information query
IPC分类:
