Invention Grant
- Patent Title: High voltage filter assembly
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Application No.: US16355153Application Date: 2019-03-15
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Publication No.: US11508554B2Publication Date: 2022-11-22
- Inventor: Anurag Kumar Mishra , James Rogers , Leonid Dorf , Rajinder Dhindsa , Olivier Luere
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/683

Abstract:
Embodiments described herein are applicable for use in all types of plasma assisted or plasma enhanced processing chambers and also for methods of plasma assisted or plasma enhanced processing of a substrate. More specifically, embodiments of this disclosure include a broadband filter assembly, also referred to herein as a filter assembly, that is configured to reduce and/or prevent RF leakage currents from being transferred from one or more RF driven components to a ground through other electrical components that are directly or indirectly electrically coupled to the RF driven components and ground with high input impedance (low current loss) making it compatible with shaped DC pulse bias applications.
Public/Granted literature
- US20200243303A1 HIGH VOLTAGE FILTER ASSEMBLY Public/Granted day:2020-07-30
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