发明授权
- 专利标题: Coordinating overheating assistance information in a dual connectivity configuration
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申请号: US17247308申请日: 2020-12-07
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公开(公告)号: US11510093B2公开(公告)日: 2022-11-22
- 发明人: Shanshan Wang , Xipeng Zhu , Arvind Vardarajan Santhanam , Ozcan Ozturk , Mouaffac Ambriss
- 申请人: QUALCOMM Incorporated
- 申请人地址: US CA San Diego
- 专利权人: QUALCOMM Incorporated
- 当前专利权人: QUALCOMM Incorporated
- 当前专利权人地址: US CA San Diego
- 代理机构: Harrity & Harrity, LLP
- 主分类号: H04W28/02
- IPC分类号: H04W28/02 ; H04W28/08 ; H04B7/0452 ; H04L5/00
摘要:
Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a first base station (BS) may receive, from a user equipment (UE), an overheating assistance information communication that indicates a maximum quantity of component carriers, combined between the first BS and a second BS, for the UE. The first BS may transmit, to the second BS, a request to reduce a quantity of component carriers of the second BS configured for the UE such that a total quantity of component carriers, between the first BS and the second BS, configured for the UE satisfies the maximum quantity of component carriers. Numerous other aspects are provided.
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