Invention Grant
- Patent Title: Coordinating overheating assistance information in a dual connectivity configuration
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Application No.: US17247308Application Date: 2020-12-07
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Publication No.: US11510093B2Publication Date: 2022-11-22
- Inventor: Shanshan Wang , Xipeng Zhu , Arvind Vardarajan Santhanam , Ozcan Ozturk , Mouaffac Ambriss
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Harrity & Harrity, LLP
- Main IPC: H04W28/02
- IPC: H04W28/02 ; H04W28/08 ; H04B7/0452 ; H04L5/00

Abstract:
Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a first base station (BS) may receive, from a user equipment (UE), an overheating assistance information communication that indicates a maximum quantity of component carriers, combined between the first BS and a second BS, for the UE. The first BS may transmit, to the second BS, a request to reduce a quantity of component carriers of the second BS configured for the UE such that a total quantity of component carriers, between the first BS and the second BS, configured for the UE satisfies the maximum quantity of component carriers. Numerous other aspects are provided.
Public/Granted literature
- US20210250805A1 COORDINATING OVERHEATING ASSISTANCE INFORMATION IN A DUAL CONNECTIVITY CONFIGURATION Public/Granted day:2021-08-12
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