Invention Grant
- Patent Title: Ball jumping apparatus and ball absorption
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Application No.: US17216922Application Date: 2021-03-30
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Publication No.: US11511363B2Publication Date: 2022-11-29
- Inventor: Sangkeun Ahn , Hyeji Shin , Dongsoo Lee , Sangho Jang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2020-0092446 20200724
- Main IPC: B23K3/06
- IPC: B23K3/06 ; B06B1/10 ; H01L23/00

Abstract:
Disclosed are ball jumping apparatuses and ball absorption methods using the same. The ball jumping apparatus comprises a fixing part, a moving part spaced apart from the fixing part, and a resilient member that connects the fixing part and the moving part to each other. The resilient member extends upwardly from the fixing part and has a connection with the moving part. The fixing part includes a fixing plate that spreads in a horizontal direction. The moving part includes an oscillating vessel that has a ball receiving space in which a ball is received, and an oscillator coupled to the oscillating vessel. A bottom surface of the oscillating vessel is upwardly spaced apart from a top surface of the fixing plate.
Public/Granted literature
- US20220023963A1 BALL JUMPING APPARATUS AND BALL ABSORPTION METHOD USING THE SAME Public/Granted day:2022-01-27
Information query
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