Invention Grant
- Patent Title: Coating method for liquid metal thermal grease and heat dissipation module
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Application No.: US16931560Application Date: 2020-07-17
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Publication No.: US11515231B2Publication Date: 2022-11-29
- Inventor: Chia-Chang Lee , Chun-Chieh Wong , Cheng-Yu Wang , Tai-Min Hsu , Yao-Jen Chang
- Applicant: ASUSTeK COMPUTER INC.
- Applicant Address: TW Taipei
- Assignee: ASUSTeK COMPUTER INC.
- Current Assignee: ASUSTeK COMPUTER INC.
- Current Assignee Address: TW Taipei
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW108130684 20190827
- Main IPC: H01L23/373
- IPC: H01L23/373 ; B05C9/12 ; B05D5/12

Abstract:
A coating method applied to perform coating with liquid metal thermal grease and a heat dissipation module are provided. The coating method includes: providing liquid metal thermal grease on a surface of an electronic element, and scraping the liquid metal thermal grease by a scraper, to coat the surface of the electronic element with the liquid metal thermal grease. A surface of the scraper is roughened. According to the coating method, the surface of the electronic element is evenly coated with the liquid metal thermal grease effectively.
Public/Granted literature
- US20210066160A1 COATING METHOD FOR LIQUID METAL THERMAL GREASE AND HEAT DISSIPATION MODULE Public/Granted day:2021-03-04
Information query
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