Invention Grant
- Patent Title: Plurality of heat sinks for a semiconductor package
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Application No.: US17264792Application Date: 2019-07-29
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Publication No.: US11515237B2Publication Date: 2022-11-29
- Inventor: Gongyue Tang , Kazunori Yamamoto , Xiaowu Zhang
- Applicant: Agency for Science, Technology and Research
- Applicant Address: SG Singapore
- Assignee: Agency for Science, Technology and Research
- Current Assignee: Agency for Science, Technology and Research
- Current Assignee Address: SG Singapore
- Agency: Womble Bond Dickinson (US) LLP
- Priority: SG10201806765V 20180808
- International Application: PCT/SG2019/050368 WO 20190729
- International Announcement: WO2020/032871 WO 20200213
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L21/00 ; H05K7/18 ; H05K7/20 ; H01L23/495 ; H01L23/538 ; H01L23/00 ; H01L25/18 ; H01L25/00 ; H01L23/367 ; H01L23/473
Abstract:
Various embodiments may provide a semiconductor package. The semiconductor package may include a first electrical component, a second electrical component, a first heat sink, and a second heat sink bonded to a first package interconnection component and a second package interconnection component. The first package interconnection component and the second package interconnection component may provide lateral and vertical interconnections in the package.
Public/Granted literature
- US20210296217A1 SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME Public/Granted day:2021-09-23
Information query
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