Invention Grant
- Patent Title: LED transfer method and display module manufactured thereby
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Application No.: US16891242Application Date: 2020-06-03
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Publication No.: US11515294B2Publication Date: 2022-11-29
- Inventor: Ohjae Kwon , Jinmo Kang , Donghwan Kim , Yong Namkung , Seondeok Hwang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2019-0084598 20190712
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L25/075 ; H01L25/16

Abstract:
A micro light emitting diode (LED) transfer method includes: preparing a transfer substrate including a plurality of micro LEDs, the plurality of micro LEDs having electrodes disposed in a first direction and a second direction different from the first direction on the transfer substrate; sequentially transferring a first set of micro LEDs among the plurality of micro LEDs in block units from the transfer substrate to first regions of a target substrate; and sequentially transferring a second set of micro LEDs among the plurality of micro LEDs in block units from the transfer substrate to second regions of the target substrate, and in the sequential transferring of the second set of micro LEDs, the second set of micro LEDs transferred to the second regions are disposed in the same electrode direction as an electrode direction of the first set of micro LEDs transferred to the first regions.
Public/Granted literature
- US20210013184A1 LED TRANSFER METHOD AND DISPLAY MODULE MANUFACTURED THEREBY Public/Granted day:2021-01-14
Information query
IPC分类: