- 专利标题: Heat sink and printed circuit board arrangements for data storage systems
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申请号: US17025968申请日: 2020-09-18
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公开(公告)号: US11516941B2公开(公告)日: 2022-11-29
- 发明人: Mohamad El-Batal , David Copeland
- 申请人: Seagate Technology LLC
- 申请人地址: US CA Fremont
- 专利权人: Seagate Technology LLC
- 当前专利权人: Seagate Technology LLC
- 当前专利权人地址: US CA Fremont
- 代理机构: Faegre Drinker Biddle & Reath LLP
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; H05K1/02
摘要:
A system includes an enclosure having an air inlet end and an air outlet end, air movers positioned near the air outlet end, a first data connector positioned near the air outlet end between the air movers, a heat-generating electrical component positioned immediately between the data connector and the air inlet end, a first heat sink positioned immediately between at least one of the air movers and the air inlet end, and a first conductive pipe thermally coupled between the heat-generating electrical component and the first heat sink.
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