- 专利标题: Semiconductor device with field plate electrode
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申请号: US17177749申请日: 2021-02-17
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公开(公告)号: US11522058B2公开(公告)日: 2022-12-06
- 发明人: Tsuyoshi Kachi
- 申请人: Kabushiki Kaisha Toshiba , Toshiba Electronic Devices & Storage Corporation
- 申请人地址: JP Tokyo; JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- 当前专利权人: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- 当前专利权人地址: JP Tokyo; JP Tokyo
- 代理机构: Allen & Overy LLP
- 优先权: JPJP2020-153263 20200911
- 主分类号: H01L29/40
- IPC分类号: H01L29/40 ; H01L29/78 ; H01L29/06
摘要:
A semiconductor device includes a first electrode, a first semiconductor layer connected to the first electrode, a second semiconductor layer on the first semiconductor layer, a third semiconductor layer on the second semiconductor layer, a fourth semiconductor layer on the third semiconductor layer, a second electrode connected to the third and fourth semiconductor layers, a gate electrode extending from the fourth toward the second semiconductor layer next to the third semiconductor layer, a field plate electrode extending in a direction from the fourth toward the second semiconductor layer next to the second semiconductor layer, and a first insulating film between the field plate electrode and the second semiconductor layer and having a lower end further from the field plate electrode than the first semiconductor layer; the first, second, and fourth semiconductor layers are of a first conductivity type; and the third semiconductor layer is of a second conductivity type.
公开/授权文献
- US20220085177A1 SEMICONDUCTOR DEVICE 公开/授权日:2022-03-17
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