Invention Grant
- Patent Title: Data units for additive manufacturing
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Application No.: US17188971Application Date: 2021-03-01
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Publication No.: US11524461B2Publication Date: 2022-12-13
- Inventor: Vicente Granados Asensio , Emilio Lopez Matos , Ismael Chanclon Fernandez , Jorge Castano Aspas , Salvador Sanchez Ribes , Luis Garcia Garcia , Carmen Blasco
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- Main IPC: B29C64/386
- IPC: B29C64/386 ; H04L9/40 ; B33Y30/00 ; B33Y50/00 ; B29C64/255

Abstract:
In an example, a data unit includes a mounting to removably mount the data unit on a receiving portion of an additive manufacturing build material container, a data source to provide data comprising a plurality of additive manufacturing parameters and a communications interface to communicate with a reader of an additive manufacturing build material processing apparatus. The communications interface is to transmit data from the data source to the additive manufacturing build material processing apparatus.
Public/Granted literature
- US20210178694A1 DATA UNITS FOR ADDITIVE MANUFACTURING Public/Granted day:2021-06-17
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