Invention Grant
- Patent Title: Metal compounds and methods of fabricating semiconductor devices using the same
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Application No.: US16857292Application Date: 2020-04-24
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Publication No.: US11524973B2Publication Date: 2022-12-13
- Inventor: Seung-Min Ryu , Akio Saito , Takanori Koide , Atsushi Yamashita , Kazuki Harano , Gyu-Hee Park , Soyoung Lee , Jaesoon Lim , Younjoung Cho
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR10-2019-0056596 20190514,KR10-2019-0138404 20191101
- Main IPC: C07F9/00
- IPC: C07F9/00 ; H01L21/285 ; H01L51/00 ; H01L49/02
Abstract:
Described herein are metal compounds and methods of fabricating semiconductor devices using the same. The metal compounds include a material of Chemical Formula 1.
Information query
