Invention Grant
- Patent Title: Wafer-level testing of lasers attached to photonics chips
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Application No.: US15930876Application Date: 2020-05-13
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Publication No.: US11531172B2Publication Date: 2022-12-20
- Inventor: Zhuojie Wu , Bo Peng
- Applicant: GLOBALFOUNDRIES U.S. Inc.
- Applicant Address: US CA Santa Clara
- Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Thompson Hine LLP
- Agent Anthony Canale
- Main IPC: G01J3/18
- IPC: G01J3/18 ; G02B6/42 ; G02B6/43 ; G02B6/293

Abstract:
Structures for a photonics chip, testing methods for a photonics chip, and methods of forming a structure for a photonics chip. A photonics chip includes a first waveguide, a second waveguide, an optical tap coupling the first waveguide to the second waveguide, and a photodetector coupled to the second waveguide. A laser is attached to the photonics chip. The laser is configured to generate laser light directed by the first waveguide to the optical tap.
Public/Granted literature
- US20210356684A1 WAFER-LEVEL TESTING OF LASERS ATTACHED TO PHOTONICS CHIPS Public/Granted day:2021-11-18
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