Invention Grant
- Patent Title: Thin film inductor and power conversion circuit
-
Application No.: US16015930Application Date: 2018-06-22
-
Publication No.: US11532420B2Publication Date: 2022-12-20
- Inventor: Heqian Yang , Yongfa Zhu , Xiaolong Luo
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Conley Rose, P.C.
- Priority: CN201610248079.9 20160420
- Main IPC: H01F3/14
- IPC: H01F3/14 ; H01F27/24 ; H02M3/155 ; H01F17/00 ; H01F27/30 ; H01F27/38 ; H01F17/04 ; H01F27/245 ; H01F27/28 ; H01F41/02

Abstract:
A thin film inductor is disclosed, which includes a thin film magnetic core. The thin film magnetic core includes at least one magnetic thin film. In each magnetic thin film, at least one type-1 gap is provided. A length direction of the type-1 gap is parallel to a direction of hard magnetization of the magnetic thin film. If the thin film magnetic core comprises at least two magnetic thin films, the at least two magnetic thin films are laminated and overlap each other. A sum of widths of all type-1 gaps in each magnetic thin film is the same.
Public/Granted literature
- US20180301270A1 Thin Film Inductor and Power Conversion Circuit Public/Granted day:2018-10-18
Information query