Invention Grant
- Patent Title: Thin film capacitor and electronic circuit board
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Application No.: US17270080Application Date: 2019-08-27
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Publication No.: US11532435B2Publication Date: 2022-12-20
- Inventor: Kumiko Yamazaki , Takeshi Shibahara , Junichi Yamazaki
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2018-163794 20180831
- International Application: PCT/JP2019/033544 WO 20190827
- International Announcement: WO2020/045446 WO 20200305
- Main IPC: H01G4/12
- IPC: H01G4/12 ; H01G4/33 ; H05K1/16 ; H01G4/008

Abstract:
A thin film capacitor for which electrode conductivity is high and electrode irregularities are unlikely to be generate even if the capacitor if heated up to 700° C. This thin film capacitor has a first electrode, a dielectric layer, and a second electrode. The dielectric layer contains an ABO2N-type oxynitride. The nitrogen concentration of the part of the dielectric layer that contacts the first electrode is no more than half the nitrogen concentration of the center part of the dielectric layer.
Public/Granted literature
- US20210241974A1 THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD Public/Granted day:2021-08-05
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