Invention Grant
- Patent Title: Multilayer electronic component and method for manufacturing multilayer electronic component
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Application No.: US16930350Application Date: 2020-07-16
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Publication No.: US11532438B2Publication Date: 2022-12-20
- Inventor: Takehisa Sasabayashi , Kiyoshiro Ishibe , Kenji Ueno , Ai Fukumori , Akihiro Tsuru , Daisuke Hamada
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JPJP2019-134097 20190719
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/12 ; H01G4/248 ; H01G4/012

Abstract:
A multilayer electronic component includes a multilayer body including dielectric layers and inner electrode layers. Each of the dielectric layers includes first crystal grains defining and functioning as plate-shaped objects that have an average thickness of less than or equal to about 300 nm and an average aspect ratio of more than or equal to about 5, each of the inner electrode layers includes second crystal grains defining and functioning as plate-shaped objects that have an average thickness of less than or equal to about 150 nm and an average aspect ratio of more than or equal to about 5, where an aspect ratio is represented by a ratio of a major axis of each plate-shaped object to a thickness of the plate-shaped object with the major axis of the plate-shaped object being orthogonal or substantially orthogonal to a thickness direction of the plate-shaped object.
Public/Granted literature
- US20210020380A1 MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2021-01-21
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