Invention Grant
- Patent Title: Package integration using fanout cavity substrate
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Application No.: US17026708Application Date: 2020-09-21
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Publication No.: US11532563B2Publication Date: 2022-12-20
- Inventor: Karthik Shanmugam , Jun Zhai , Rajasekaran Swaminathan
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Aikin & Gallant, LLP
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/31 ; H05K1/18 ; H01L21/56 ; H01L25/16
Abstract:
Packages and packaging techniques are described in which a patterned carrier substrate can be used to create a reconstituted fanout substrate with a topography that can accommodate components of different thicknesses. In an embodiment, a wiring layer is formed directly on a multiple level topography of a molding compound layer including embedded components.
Public/Granted literature
- US20220093522A1 PACKAGE INTEGRATION USING FANOUT CAVITY SUBSTRATE Public/Granted day:2022-03-24
Information query
IPC分类:
