Invention Grant
- Patent Title: Semiconductor structure and method of forming the same
-
Application No.: US17134694Application Date: 2020-12-28
-
Publication No.: US11532617B2Publication Date: 2022-12-20
- Inventor: Po-Chao Tsao
- Applicant: MEDIATEK INC.
- Applicant Address: TW Hsinchu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/06 ; H01L29/423 ; H01L29/786 ; H01L21/02 ; H01L29/66

Abstract:
A semiconductor structure includes the first semiconductor stack and the second semiconductor stack formed over the first region and the second region of a substrate, respectively. The first and second semiconductor stacks extend in the first direction and are spaced apart from each other in the second direction. Each of the first semiconductor stack and the second semiconductor stack includes channel layers and a gate structure. The channel layers are formed above the substrate and are spaced apart from each other in the third direction. The gate structure includes the gate dielectric layers formed around the respective channel layers, and the gate electrode layer formed on the gate dielectric layers to surround the channel layers. The number of channel layers in the first semiconductor stack is different from the number of channel layers in the second semiconductor stack.
Public/Granted literature
- US20210313317A1 SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME Public/Granted day:2021-10-07
Information query
IPC分类: