Invention Grant
- Patent Title: Antenna module
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Application No.: US17489900Application Date: 2021-09-30
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Publication No.: US11532875B2Publication Date: 2022-12-20
- Inventor: Chung-Hsin Chiang , Li-Yu Chen , Shih-Huang Yeh
- Applicant: MEDIATEK Inc.
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK Inc.
- Current Assignee: MEDIATEK Inc.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01Q1/42

Abstract:
An antenna module includes a first dielectric layer, an antenna layer, a grounding layer and a conductive layer. The first dielectric layer has a first dielectric surface and a second dielectric surface opposite to the first dielectric surface and a first dielectric lateral surface extending between the first dielectric surface and the second dielectric surface. The antenna layer is formed on the first dielectric surface. The grounding layer is formed below the second dielectric surface. The conductive layer is formed on the first dielectric lateral surface of first dielectric layer, wherein the conductive layer electrically connects to the grounding layer and extends from the grounding layer toward the antenna layer but not contacts the first dielectric surface.
Public/Granted literature
- US20220131262A1 ANTENNA MODULE Public/Granted day:2022-04-28
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