- Patent Title: Electrically conductive sheet for use in three-dimensional molding
-
Application No.: US16464096Application Date: 2017-11-28
-
Publication No.: US11535003B2Publication Date: 2022-12-27
- Inventor: Masaharu Ito , Kanzan Inoue
- Applicant: LINTEC OF AMERICA, INC. , LINTEC CORPORATION
- Applicant Address: US AZ Phoenix; JP Tokyo
- Assignee: LINTEC OF AMERICA, INC.,LINTEC CORPORATION
- Current Assignee: LINTEC OF AMERICA, INC.,LINTEC CORPORATION
- Current Assignee Address: US AZ Phoenix; JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JPJP2016-230553 20161128
- International Application: PCT/JP2017/042678 WO 20171128
- International Announcement: WO2018/097323 WO 20180531
- Main IPC: B32B5/12
- IPC: B32B5/12 ; H05B3/10 ; H05B3/20 ; B32B27/08

Abstract:
The present disclosure provides an electrically conductive sheet for use in three-dimensional molding including: a pseudo-sheet structure in which plural electrically conductive linear bodies extending unidirectionally are arranged spaced apart from each other; and a resin protective layer provided on a surface of the pseudo-sheet structure. In the above mentioned electrically conductive sheet, each of the electrically conductive linear bodies in the pseudo-sheet structure includes: a first portion formed in a wave pattern having a wavelength λ1 and an amplitude A1; and a second portion formed in a wave pattern having a wavelength λ2 and an amplitude A2, at least one of which is different from the wavelength λ1 or the amplitude A1 of the first portion.
Public/Granted literature
- US20190297676A1 ELECTRICALLY CONDUCTIVE SHEET FOR USE IN THREE-DIMENSIONAL MOLDING Public/Granted day:2019-09-26
Information query