Invention Grant
- Patent Title: Vane arc segment with thermal insulation element
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Application No.: US17102575Application Date: 2020-11-24
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Publication No.: US11536148B2Publication Date: 2022-12-27
- Inventor: Raymond Surace , Mark F. Zelesky
- Applicant: RAYTHEON TECHNOLOGIES CORPORATION
- Applicant Address: US CT Farmington
- Assignee: RAYTHEON TECHNOLOGIES CORPORATION
- Current Assignee: RAYTHEON TECHNOLOGIES CORPORATION
- Current Assignee Address: US CT Farmington
- Agency: Carlson, Gaskey & Olds, P.C.
- Main IPC: F01D9/04
- IPC: F01D9/04 ; F01D5/08 ; F01D5/18 ; F01D5/28

Abstract:
A vane arc segment includes an airfoil piece that defines first and second platforms and an airfoil section that extends between the first and second platforms. The first platform defines a gaspath side, a non-gaspath side, and a first platform radial flange that projects from the non-gaspath side. Support hardware supports the airfoil piece via the first platform radial flange. A thermal insulation element is situated adjacent the first platform radial flange. The support hardware supports the airfoil piece through the thermal insulation element.
Public/Granted literature
- US20220162945A1 VANE ARC SEGMENT WITH THERMAL INSULATION ELEMENT Public/Granted day:2022-05-26
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