Invention Grant
- Patent Title: Hinge module and foldable electronic device including the same
-
Application No.: US16792424Application Date: 2020-02-17
-
Publication No.: US11537173B2Publication Date: 2022-12-27
- Inventor: Jungjin Kim , Jongyoon Kim , Chungkeun Yoo , Jongmin Kang , Suman Lee , Sungkyu Hwang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Cha & Reiter, LLC
- Priority: KR10-2019-0019576 20190219
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H04M1/02

Abstract:
A hinge module according to one embodiment includes a fixed structure including a central portion, a guide portion having an edge facing an edge of the central portion, and a support portion configured to connect the central portion and the guide portion, wherein an interior space is formed between the central portion and the guide portion, a connecting shaft extending into the interior space through the central portion and including a gear formed on at least a part of an outer circumferential surface of the connecting shaft, and a rotary structure disposed in the interior space, the rotary structure including a circular arc shaped gear having a plurality of gear teeth arranged in a circular arc shape and that are engaged with the gear, wherein the rotary structure rotates about a virtual axis of rotation passing through a center of a circular arc of the circular arc shaped gear.
Public/Granted literature
- US20200264673A1 HINGE MODULE AND FOLDABLE ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2020-08-20
Information query