Systems, methods and apparatus are provided for an array of vertically stacked memory cells having horizontally oriented access devices having a first source/drain region and a second source drain region separated by a channel region, and gates opposing the channel region, vertically oriented access lines coupled to the gates and separated from a channel region by a gate dielectric. The memory cells have horizontally oriented storage nodes coupled to the second source/drain region and horizontally oriented digit lines coupled to the first source/drain regions. In one example, an insulator material is formed on a surface of the first source/drain region and a conductor material formed on the insulator material to form a metal insulator semiconductor (MIS) interface between the horizontally oriented digit lines and the first source/drain regions of the horizontally oriented access devices.