- 专利标题: Fingerprint identification substrate and manufacturing method therefor, identification method and display apparatus
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申请号: US17359507申请日: 2021-06-26
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公开(公告)号: US11538848B2公开(公告)日: 2022-12-27
- 发明人: Yue Geng , Cheng Li , Zhonghuan Li , Kuiyuan Wang , Yi Dai , Zefei Li , Chaoyang Qi , Yajie Feng , Xiaoguan Li
- 申请人: Beijing BOE Sensor Technology Co., Ltd. , BOE Technology Group Co., Ltd.
- 申请人地址: CN Beijing; CN Beijing
- 专利权人: Beijing BOE Sensor Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- 当前专利权人: Beijing BOE Sensor Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- 当前专利权人地址: CN Beijing; CN Beijing
- 代理机构: Ling and Yang Intellectual Property
- 代理商 Ling Wu; Stephen Yang
- 优先权: CN202011345552.8 20201125
- 主分类号: H01L27/146
- IPC分类号: H01L27/146 ; G06V40/13 ; G06V40/12 ; G06V10/147 ; H01L27/30
摘要:
Provided a fingerprint identification substrate and a manufacturing method therefor, a identification method, and a display apparatus. The fingerprint identification substrate includes a substrate and at least two kinds of identification pixels disposed on the substrate, a first identification pixel includes a first photodiode and a second identification pixel includes a second photodiode. The first photodiode includes a first electrode, a first photoelectric conversion layer and a second electrode, the second photodiode includes the first electrode, a second photoelectric conversion layer and the second electrode, and the first photoelectric conversion layer and the second photoelectric conversion layer have different spectral response characteristics to red light or infrared light.
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