Invention Grant
- Patent Title: Semiconductor package
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Application No.: US17019519Application Date: 2020-09-14
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Publication No.: US11545440B2Publication Date: 2023-01-03
- Inventor: Yonghwan Kwon
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR10-2019-0168552 20191217
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/31 ; H01L25/10 ; H01L23/00

Abstract:
A semiconductor package includes a redistribution substrate including a first redistribution layer, a first molding member on the redistribution substrate, a second redistribution layer on an upper surface of the first molding member and having a redistribution pad, an electrical connection pad on an upper surface of a second molding member and electrically connected to the second redistribution layer, and a passivation layer on the second molding member and having an opening exposing at least a portion of the electrical connection pad. The electrical connection pad includes a conductor layer, including a first metal, and a contact layer on the conductor layer and including a second metal. The redistribution pad includes a third metal, different from the first metal and the second metal. The portion of the electrical connection pad, exposed by the opening, has a width greater than a width of the redistribution pad.
Public/Granted literature
- US20210183785A1 SEMICONDUCTOR PACKAGE Public/Granted day:2021-06-17
Information query
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