Invention Grant
- Patent Title: Method of dummy pattern layout
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Application No.: US17150960Application Date: 2021-01-15
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Publication No.: US11545484B2Publication Date: 2023-01-03
- Inventor: Jui-Fa Lu , Chien-Nan Lin , Ching-Hua Yeh
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Priority: CN201710706341.4 20170817
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L29/06 ; H01L29/49 ; H01L23/528 ; H01L29/66 ; H01L23/532 ; H01L49/02 ; H01L23/522 ; G06F30/39 ; G06F30/392 ; G06F119/18

Abstract:
A design method of a dummy pattern layout including the following steps is provided. An integrated circuit layout design including resistor elements is obtained via a computer. The locations of dummy conductive structures are configured, wherein the dummy conductive structures are aligned with the resistor elements. The locations of dummy support patterns are configured, wherein each of the dummy support patterns is configured between two adjacent dummy conductive structures, and each of the dummy conductive structures is equidistant from the dummy support patterns on both sides.
Public/Granted literature
- US20210134790A1 DESIGN METHOD OF DUMMY PATTERN LAYOUT Public/Granted day:2021-05-06
Information query
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