Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17406162Application Date: 2021-08-19
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Publication No.: US11545554B2Publication Date: 2023-01-03
- Inventor: Doosan Back , Dongoh Kim , Gyuhyun Kil , Jung-Hoon Han
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2020-0174793 20201214
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/417 ; H01L29/51

Abstract:
A semiconductor device includes a gate stack including a gate insulating layer and a gate electrode on the gate insulating layer. The gate insulating layer includes a first dielectric layer and a second dielectric layer on the first dielectric layer, and a dielectric constant of the second dielectric layer is greater than a dielectric constant of the first dielectric layer. The semiconductor device also includes a first spacer on a side surface of the gate stack, and a second spacer on the first spacer, wherein the second spacer includes a protruding portion extending from a level lower than a lower surface of the first spacer towards the first dielectric layer, and a dielectric constant of the second spacer is greater than the dielectric constant of the first dielectric layer and less than a dielectric constant of the first spacer.
Public/Granted literature
- US20220190132A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-06-16
Information query
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