An electronic assembly includes a flexible printed circuit board (PCB) circumferentially disposed around a motor and a thermal management assembly (TMA) thermally connected to the flexible PCB. One or more switching semiconductor devices are disposed on a first surface of the flexible PCB. The TMA includes a cooling jacket, at least one jacket manifold formed through the cooling jacket and a thermal compensation base layer thermally coupled to the cooling jacket. The cooling jacket is mounted around a circumference of the motor and has a mounting surface concentric with the circumference of the motor. The mounting surface is coupled to the first surface of the flexible PCB. The at least one jacket manifold has a fluid inlet and a fluid outlet defining a fluid flow area therebetween. The thermal compensation base layer is thermally coupled to the cooling jacket and the one or more switching semiconductor devices.