Invention Grant
- Patent Title: Machining device, machining unit, and machining method
-
Application No.: US14381507Application Date: 2013-02-28
-
Publication No.: US11548097B2Publication Date: 2023-01-10
- Inventor: Saneyuki Goya , Masato Kinouchi , Toshiya Watanabe
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPJP2012-051023 20120307
- International Application: PCT/JP2013/055469 WO 20130228
- International Announcement: WO2013/133128 WO 20130912
- Main IPC: B23K26/38
- IPC: B23K26/38 ; B23K26/08 ; B23K26/06 ; B29C59/16 ; C04B41/00

Abstract:
Provided are a machining device (10), a machining unit, and a machining method that irradiate a workpiece (8) with a laser beam to perform cutting or boring machining of the workpiece (8). The invention has a laser output device (12), a guiding optical system (14) that guides a laser beam, and an irradiating head (16) that guides a laser beam and irradiates the workpiece (8) with the laser beam. The irradiating head (16) integrally rotates a first prism (52) and a second prism (54) with a rotation mechanism, thereby rotating a light path of the laser beam around a rotational axis of the rotation mechanism and irradiating the workpiece (8) while rotating the position of irradiation to the workpiece. A control device (22) calculates an allowable rotational frequency range of the laser beam on the basis of the relationship between an allowable thickness of a remelted layer of the workpiece (8) and a rotational frequency, or the relationship between an allowable thickness of an oxidization layer of the workpiece and the rotational frequency, determines a rotational frequency included in the allowable rotational frequency range as the rotational frequency of the rotation mechanism, and rotates the rotation mechanism at the determined rotational frequency, thereby enabling high-precision machining to be performed with a simple configuration.
Public/Granted literature
- US20150014889A1 MACHINING DEVICE, MACHINING UNIT, AND MACHINING METHOD Public/Granted day:2015-01-15
Information query
IPC分类: