Invention Grant
- Patent Title: Multilayer coil component
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Application No.: US16876927Application Date: 2020-05-18
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Publication No.: US11551846B2Publication Date: 2023-01-10
- Inventor: Noriaki Hamachi , Kazuya Tobita , Youichi Kazuta , Yuto Shiga
- Applicant: TDK Corporation
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2019-105108 20190605
- Main IPC: H01F17/00
- IPC: H01F17/00 ; H01F3/14 ; H01F27/29

Abstract:
A coil is disposed in an element body such that a gap between the coil and a first principal surface is larger than a gap between the coil and a second principal surface, and has a coil axis along a direction intersecting with a direction in which the first principal surface and the second principal surface oppose each other. A terminal electrode is disposed on the element body such that at least a part of the first principal surface and a part of the second principal surface are exposed. The coil includes a plurality of coil conductors separated from each other in a direction along the coil axis and a through-hole conductor connecting the coil conductors adjacent to each other in the direction along the coil axis. The through-hole conductor does not overlap the plurality of terminal electrodes when viewed from the direction along the coil axis.
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F17/00 | 信号类型的固定电感器 |