- 专利标题: Solid-state imaging sensor
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申请号: US17387127申请日: 2021-07-28
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公开(公告)号: US11557621B2公开(公告)日: 2023-01-17
- 发明人: Itaru Oshiyama , Hiroshi Tanaka
- 申请人: SONY GROUP CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: SONY GROUP CORPORATION
- 当前专利权人: SONY GROUP CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Sheridan Ross P.C.
- 优先权: JP2015-114525 20150605
- 主分类号: H01L27/146
- IPC分类号: H01L27/146 ; G02B1/115 ; G02B1/118 ; H01L27/14 ; H04N5/369 ; H04N5/357
摘要:
The present technology relates to a solid state imaging sensor that is possible to suppress the reflection of incident light with a wide wavelength band. A reflectance adjusting layer is provided on the substrate in an incident direction of the incident light with respect to the substrate such as Si and configured to adjust reflection of the incident light on the substrate. The reflectance adjusting layer includes a first layer formed on the substrate and a second layer formed on the first layer. The first layer includes a concavo-convex structure provided on the substrate and a material which is filled into a concave portion of the concavo-convex structure and has a refractive index lower than that of the substrate, and the second layer includes a material having a refractive index lower than that of the first layer. It is possible to reduce the reflection on the substrate such as Si by using the principle of the interference of the thin film. Such a technology can be applied to solid state imaging sensors.
公开/授权文献
- US20210358987A1 SOLID-STATE IMAGING SENSOR 公开/授权日:2021-11-18
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