Invention Grant
- Patent Title: Ground discontinuities for thermal isolation
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Application No.: US16950610Application Date: 2020-11-17
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Publication No.: US11558955B2Publication Date: 2023-01-17
- Inventor: Trevor Timpane , Layne A. Berge , Patryk Gumann , Sean Hart , Curtis Eugene Larsen , Michael Good
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Amin, Turocy & Watson, LLP
- Main IPC: H05K1/02
- IPC: H05K1/02 ; G06N10/00 ; H01L39/04 ; H05K1/09 ; H05K1/18 ; H05K3/02 ; H05K3/32 ; H05K1/11

Abstract:
A quantum mechanical circuit includes a substrate; a first electrical conductor and a second electrical conductor provided on the substrate and spaced apart to provide a gap therebetween; and a third electrical conductor to electrically connect the first electrical conductor and the second electrical conductor. The third electrical conductor is a poor thermal conductor.
Public/Granted literature
- US20220159822A1 GROUND DISCONTINUITIES FOR THERMAL ISOLATION Public/Granted day:2022-05-19
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