Invention Grant
- Patent Title: Shape memory thermal capacitor and methods for same
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Application No.: US16900390Application Date: 2020-06-12
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Publication No.: US11558957B2Publication Date: 2023-01-17
- Inventor: David H. Altman , Christopher H. Peters , Gregory P. Schaefer , Philip M. Henault , Darin J. Sharar
- Applicant: Raytheon Company , THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY
- Applicant Address: US MA Waltham; US MD Adelphi
- Assignee: Raytheon Company,THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY
- Current Assignee: Raytheon Company,THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY
- Current Assignee Address: US MA Waltham; US MD Adelphi
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/00

Abstract:
An electronic assembly including a thermal capacitor. An electronic substrate of the electronic assembly includes one or more insulating layers and one or more conductor layers provided along the one or more insulating layers. The one or more conductor layers including a conductive material. A shape memory thermal capacitor is received in the electronic substrate. The shape memory thermal capacitor includes a shape memory core including a shape memory material.
Public/Granted literature
- US20210392737A1 SHAPE MEMORY THERMAL CAPACITOR AND METHODS FOR SAME Public/Granted day:2021-12-16
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