Invention Grant
- Patent Title: Fluidic die with surface condition monitoring
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Application No.: US17058690Application Date: 2019-01-31
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Publication No.: US11559987B2Publication Date: 2023-01-24
- Inventor: Eric Martin , Daryl E. Anderson , James R. Przybyla , Chien-Hua Chen , Diane R. Hammerstad
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Foley & Lardner LLP
- International Application: PCT/US2019/016083 WO 20190131
- International Announcement: WO2020/159517 WO 20200806
- Main IPC: B41J2/045
- IPC: B41J2/045 ; B41J2/14

Abstract:
One example provides a fluidic die including a nozzle layer disposed on a substrate, the nozzle layer having an upper surface opposite the substrate and including a plurality of nozzles formed therein, each nozzle including a fluid chamber and a nozzle orifice extending through the nozzle layer from the upper surface to the fluid chamber. A conductive trace is exposed to the upper surface of the nozzle layer and extends proximate to a portion of the nozzle orifices, an impedance of the conductive trace indicative of a surface condition of the upper surface of the nozzle layer.
Public/Granted literature
- US20210370668A1 FLUIDIC DIE WITH SURFACE CONDITION MONITORING Public/Granted day:2021-12-02
Information query
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