Invention Grant
- Patent Title: Adjusting tension of a substrate
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Application No.: US17261046Application Date: 2018-12-10
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Publication No.: US11560002B2Publication Date: 2023-01-24
- Inventor: Ignasi Bonjoch Roma , Josep Bel Calavia , Andreu Vinets Alonso
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- International Application: PCT/US2018/064751 WO 20181210
- International Announcement: WO2020/122858 WO 20200618
- Main IPC: B41J11/46
- IPC: B41J11/46 ; B41J15/16 ; B65H23/185 ; B65H23/198 ; B65H23/18

Abstract:
An example method comprises operating a drive unit to advance a substrate in a substrate advance direction toward a printing station. At the printing station, a first line is printed onto the substrate. A drive unit is instructed to advance the substrate in the substrate advance direction by a target amount, and a second line is printed onto the substrate. The distance between the first and second lines in a direction perpendicular to the substrate advance direction is calculated and, based on the calculated difference, a tension of the substrate is modified.
Public/Granted literature
- US20210309029A1 ADJUSTING TENSION OF A SUBSTRATE Public/Granted day:2021-10-07
Information query
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