Invention Grant
- Patent Title: System and methods for managing heat in a photonic integrated circuit
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Application No.: US16929850Application Date: 2020-07-15
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Publication No.: US11563136B2Publication Date: 2023-01-24
- Inventor: John Heanue
- Applicant: Acacia Communications, Inc.
- Applicant Address: US MA Maynard
- Assignee: Acacia Communications, Inc.
- Current Assignee: Acacia Communications, Inc.
- Current Assignee Address: US MA Maynard
- Agency: K&L Gates LLP
- Main IPC: H01L31/024
- IPC: H01L31/024 ; H01L31/12 ; H01L31/02 ; H01L31/0203
Abstract:
In part, in one aspect, the disclosure relates to a system including a photonic integrated circuit (PIC) assembly, comprising a PIC comprising: a first bond pad disposed inward from an edge of the PIC a first distance; and a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than 0.4 mm.
Public/Granted literature
- US20220020893A1 SYSTEM AND METHODS FOR MANAGING HEAT IN A PHOTONIC INTEGRATED CIRCUIT Public/Granted day:2022-01-20
Information query
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