Invention Grant
- Patent Title: Chip-on film package and display device including the same
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Application No.: US17347623Application Date: 2021-06-15
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Publication No.: US11568795B2Publication Date: 2023-01-31
- Inventor: Tae Gon Im , Min Soo Choi , Ji Hyun Kim , Jun Pyo Lee
- Applicant: Samsung Display Co., Ltd.
- Applicant Address: KR Yongin-Si
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin-Si
- Agency: Innovation Counsel LLP
- Priority: KR10-2020-0123299 20200923
- Main IPC: G09G3/32
- IPC: G09G3/32

Abstract:
The display device includes a display panel, a printed circuit board on which a timing controller is mounted, and a connection film on which a data driver is mounted. Pixels and a gate driving circuit are disposed in a display area of the display panel. The connection film includes output lines connecting the data driver and the display panel, and first connection lines connecting the printed circuit board and the display panel. The first connection lines overlap the first area on which the data driver is mounted and are disposed between the output lines.
Public/Granted literature
- US20220093036A1 CHIP-ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME Public/Granted day:2022-03-24
Information query
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