- 专利标题: Far infrared sensor apparatus having multiple sensing element arrays inside single package
-
申请号: US16294873申请日: 2019-03-06
-
公开(公告)号: US11573127B2公开(公告)日: 2023-02-07
- 发明人: Chih-Ming Sun , Sen-Huang Huang
- 申请人: PixArt Imaging Inc.
- 申请人地址: TW Hsin-Chu
- 专利权人: PixArt Imaging Inc.
- 当前专利权人: PixArt Imaging Inc.
- 当前专利权人地址: TW Hsin-Chu
- 代理商 Winston Hsu
- 优先权: TW105127775 20160830
- 主分类号: G01J5/12
- IPC分类号: G01J5/12 ; G01J1/02 ; G01J5/04 ; G01J5/10 ; G01J1/42 ; G01J5/08 ; G01J5/14 ; G01J5/00
摘要:
A far infrared sensor package includes a package body and a plurality of far infrared sensor array integrated circuits. The plurality of far infrared sensor array integrated circuits are disposed on a same plane and inside the package body. Each of the far infrared sensor array integrated circuits includes a far infrared sensing element array of a same size.
公开/授权文献
信息查询