Invention Grant
- Patent Title: Coil component
-
Application No.: US16530417Application Date: 2019-08-02
-
Publication No.: US11574765B2Publication Date: 2023-02-07
- Inventor: Ji Hyung Jung , Byeong Cheol Moon , Jae Hun Kim , Joung Gul Ryu
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0045930 20190419
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/29 ; H01F41/04 ; H01F41/12 ; H01F27/32

Abstract:
A coil component includes a body having one surface and the other surface facing each other, and having one end surface and the other end surface facing each other in one direction; a supporting substrate embedded in the body; a coil portion disposed on the supporting substrate; a first lead-out portion connected to one end of the coil portion and exposed from the body; and a second lead-out portion connected to the other end of the coil portion and exposed from the body. The coil portion has a first pattern region facing the one surface and a second pattern region facing the other surface, each of the first and second pattern regions extends in the one direction, and a distance of the first pattern region in the one direction is shorter than a distance of the second pattern region in the one direction.
Public/Granted literature
- US20200335256A1 COIL COMPONENT Public/Granted day:2020-10-22
Information query