Invention Grant
- Patent Title: Patterns on objects in additive manufacturing
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Application No.: US17256691Application Date: 2019-03-15
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Publication No.: US11577463B2Publication Date: 2023-02-14
- Inventor: Wei Huang , Gary J. Dispoto , Craig Peter Sayers
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Shook, Hardy & Bacon L.L.P.
- International Application: PCT/US2019/022482 WO 20190315
- International Announcement: WO2020/190260 WO 20200924
- Main IPC: B29C64/386
- IPC: B29C64/386 ; B33Y50/00 ; G05B19/4099

Abstract:
In an example, a method includes operating, by a processor, on object model data and operating, on a processor, on pattern data. The object model data describes at least part of an object to be generated in additive manufacturing and the pattern data describes an object pattern intended to be formed on at least a portion of the part of the object to be generated in additive manufacturing. The method includes determining, by a processor, control data to control a print agent applicator to apply a pattern of fusing agent onto a part of a layer of build material. The pattern of fusing agent comprises a fusing agent area and a gap area that lacks fusing agent. The gap area corresponds to the object pattern such that no fusing agent is applied to a part of the layer of build material that corresponds to the object pattern.
Public/Granted literature
- US20210394445A1 PATTERNS ON OBJECTS IN ADDITIVE MANUFACTURING Public/Granted day:2021-12-23
Information query