Invention Grant
- Patent Title: Thermal management system for a test-and-measurement probe
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Application No.: US17096622Application Date: 2020-11-12
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Publication No.: US11578925B2Publication Date: 2023-02-14
- Inventor: Julie A. Campbell , David Thomas Engquist , Sam J. Strickling
- Applicant: Tektronix, Inc.
- Applicant Address: US OR Beaverton
- Assignee: Tektronix, Inc.
- Current Assignee: Tektronix, Inc.
- Current Assignee Address: US OR Beaverton
- Agency: Miller Nash LLP
- Agent Andrew J. Harrington
- Main IPC: G01R31/28
- IPC: G01R31/28 ; F28D7/10

Abstract:
A thermal management system for a test-and-measurement probe that includes a thermally insulated shroud and a fluid inlet conduit. The shroud is configured to enclose a first portion of a probe head of the probe within an interior cavity of the shroud, while permitting a second portion of the probe head to extend out of the shroud. The shroud further includes a fluid outlet passageway configured to permit a heat-transfer fluid to pass from a probe-head end of the interior cavity, through the interior cavity of the shroud, and out of the shroud through an access portion of the shroud. The fluid inlet conduit enters the shroud through the access portion of the shroud, extends through the interior cavity of the shroud, and is configured to introduce the heat-transfer fluid to the probe-head end of the interior cavity.
Public/Granted literature
- US20210148640A1 THERMAL MANAGEMENT SYSTEM FOR A TEST-AND-MEASUREMENT PROBE Public/Granted day:2021-05-20
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