- Patent Title: Package comprising a die and die side redistribution layers (RDL)
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Application No.: US16590718Application Date: 2019-10-02
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Publication No.: US11581262B2Publication Date: 2023-02-14
- Inventor: Aniket Patil , Brigham Navaja , Hong Bok We , Yuzhe Zhang
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Michelle Gallardo
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/31 ; H01L23/495
Abstract:
A package that includes a second redistribution portion, a die coupled to the second redistribution portion, an encapsulation layer encapsulating the die, and a first redistribution portion coupled to the second redistribution portion. The first redistribution portion is located laterally to the die. The first redistribution portion is located over the second redistribution portion. The first redistribution portion and the second redistribution portion are configured to provide one or more electrical paths for the die.
Public/Granted literature
- US20210104467A1 PACKAGE COMPRISING A DIE AND DIE SIDE REDISTRIBUTION LAYERS (RDL) Public/Granted day:2021-04-08
Information query
IPC分类:
